Quality System
   
Reliability Test &Standards
 
High Temperature Aging Test:
Test the reliability of the products in high temperature condition.		 Normal Temperature Aging Test:
Test the reliability of the products in normal temperature condition.
Reflow Soldering:
Simulate customer's reflow soldering process and condition to test the reliability of the products.		 Thermal Shock:
Test the reliability of the products in the shifts of lowest temperature to highest temperature, and vice versa.
Programmable Temperature/Humidity Test:
Check the reliability of the products in programmed temperature and humidity.		 Polish Machine:
Without any damage of LED's interior structure, we polish the product to check the cohesion condition between chip and the cup of lead frame, as well as the gold ball with the pad.
Wave soldering:
Simulate customer's wave soldering process and condition to test the reliability of the products.
 
NO Test Item Test state Test Conditions Test Hours/Cycle Sample /Size Ac/Re
1 Solder Heat Motionless state TEMP:260¡æ¡À5¡æ 10SEC 40PCS 0/1
2 DC Operating Life Development TEMP:23¡À5¡æ IF=20mA 1000HRS 40PCS 0/1
3 High Temperature Storage Motionless state TEMP:105¡æ 1000HRS 40PCS 0/1
4 Low Temperature Storage Motionless state TEMP:-45¡æ 1000HRS 40PCS 0/1
5 High Temperature High Humidity Development Ta= 65¡À5¡ãC
RH= 90 ¡« 95% 		240H¡À2H 40PCS 0/1
6 Temperature Cycle Development H:+65¡æ; RH:95% 1H
¡Ò: 10MIN
L:-25¡æ 1H 		40CYCLES 40PCS 0/1
      H:+105¡æ 30min      
7 Thermal Shock Motionless state ¡Ò3MIN 20CYCLES 40PCS 0/1
      L:-45¡æ 30min      
 
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